In collaboration we are looking for a technology enthusiast with a passion for solving complex engineering challenges.
Join our client, a global leader in information and communication solutions, as they expand their Grenoble Research Center.
The team is focused on pushing the boundaries of ICT product development, tackling technical hurdles in board-level high-speed architecture (112 Gbps+) and module reliability.
If you're ready to shape the future of hardware engineering, lead a high-performing team, and explore future-proof technologies, this is the role for you!
About the Company: Our client is a global powerhouse in ICT, with a mission to bring digital to every person, home, and organization for a fully connected, intelligent world.
Operating in over 170 countries and serving more than one-third of the global population, they drive innovation across carrier networks, enterprise solutions, consumer technologies, and cloud computing.
The Grenoble Research Center, established in 2019, is a hub for advanced technology research, housing a diverse team of over 30 PhDs, technical experts, and academics from leading companies.
What You'll Do: Lead Engineering Innovations: Guide your team to develop advanced engineering technologies for ICT products, focusing on high-speed board-level architecture (112 Gbps+) and module reliability.
Build World-Class Lab Capabilities: Establish a cutting-edge laboratory in line with the company's global strategy, leveraging local technological advantages to deliver competitive core technologies and platform solutions.
Future-Proof Technology Exploration: Stay ahead of trends by sourcing new technologies, driving the adoption of innovative solutions, and positioning the company as a leader in the local tech ecosystem.
Strengthen Local Partnerships: Foster collaboration with academic and industry partners, building a robust technological network to enhance the company's influence and competitiveness.
Grow and Empower the Team: Develop a flexible human resource strategy to attract top talent, mentor a high-performing team, and create a pipeline of fresh talent through community engagement and CSR initiatives.
Cross-Cultural Leadership: Communicate the company's core values and foster an open, innovative environment that embraces diversity and cross-cultural cooperation.
What You Bring: Extensive Experience: 10+ years in high-speed or multi-physics simulation, or board-level/module reliability engineering, with a deep understanding of 112 Gbps+ signal architecture.
Technical Expertise: Proven background in board-level design or complex module engineering, with strong skills in project management, covering commercial, technical, and legal aspects.
Analytical and Strategic Skills: Ability to align technology development with global strategy and manage a diverse, collaborative team effectively.
Cross-Cultural Competence: Comfortable navigating diverse environments and capable of conveying technical concepts and values across different cultural contexts.
Fluent in English: Strong written and spoken communication skills in English other languages are a plus.
Ideal Candidate Background: Experience with major companies such as Ericsson, Nokia, Samsung, ZTE, or Cisco would be beneficial due to their relevance in telecom and ICT innovation.
Why Join the Grenoble Research Center?
Cutting-Edge Innovation: Work on the development of next-generation hardware engineering solutions in a high-speed technology space.
Global Impact: Be part of a company dedicated to bridging the digital divide and connecting the world.
Collaborative Environment: Engage with top engineers, academics, and industry leaders in a vibrant and diverse team setting.
Strategic Role: Influence technological advancements and help shape the company's local and global technology strategy.
Ready to Lead the Future of ICT Innovation?
If you have a passion for cutting-edge technology, exceptional leadership skills, and a drive to solve complex challenges, we'd love to hear from you.
Apply now to join a forward-thinking team and make a global impact in the world of telecommunications and ICT!